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PRODUCT

PCB

PCB Process Chemicals

  • OXIDE
  • E/L Cu
  • ACID Cu
  • S/E
  • Develop/Strip
  • ENIG
  • Smart phones, Communications, Appliances, Electronics Rigid/Flexible PCB process Chemicals (e.g Plating)
  • Mobile phones , Tablets , Chargers, NFC antenna, Cables
  • Continuous development : Horizontal Electroless Copper , Conductive polymer ,ENEPIG
  • Market expansion : Domestic PCB market and Securing overseas market (China, Vietnam)

PCB 약품 소개

D/F , PSR Process (DFR Release / Cleaning)


ProductNameRatio(%)ConditionsCharacteristics
YSP-451
(Photo mask Release agent)
YSP-451
5 ~ 7YSP-451 : 50 ~ 70 ml/L
at 40 ~ 60 ℃
Dipping : 25 ~ 40 sec		1. Rapid and stable releasing by NaOH
2. Cost efficient
3, Discolor-less on Cu foil after apply
4. Rust-less (Cu, Sn, Pb)
YSP-400
(Release agent)		YSP-400
30 ~ 60YSP-400 : 300 ~ 600 ml/L
at 40 ~ 60 ℃
Dipping : 12 ~ 20 min
1.  Rapid and stable releasing by Amine
2. Exclusive agent for dry film with over 100㎛
3. Discolor-less on Cu foil after apply
4. Rust-less (Cu, Sn, Pb)
YSP-1215
(Defoamer)
YSP-1215

YSP1215 : 6.6 ~ 26 ml/100L
at 20 ~ 30 ℃ (25)
Work duration : 30 sec ~ 1 min		1.  Excellent foam removing
2. Usable together with Liquid Alkaline strippers, Super Alkaline strippers
3. Applicable to Conveyer and Spray machines without damaging
YSP-C3000
(Equipment Cleaner)
YSP-C3000
(Acid)
15 ~ 30YSP-C3000 : 20 ml/L
at 20 ~ 30 ℃ (25)
Work duration : 1 ~ 2 hour		1.  Excellent cleaning all over inside of equipment
2. Rapid dissolve of dry film or sludge
3. High dissolution to dry film or sludge
4. Applicable at room temperature → Time saving and convenient
5. Least foaming in washing after cleaning
6. No need to breakdown and reassemble of equipment
YSP-C3500
(Resin Cleaner)
YSP-C3500
(Alkali)
15 ~ 30
YSP-C3500 : 20 ml/L
at 30 ℃
Work duration : 1 ~ 2 hour
1. Excellent resin scum cleaning
2. Rust-less on equipment due to low work temperature as compared to existing alkali type cleaner
3. Applicable at room temperature → Time saving and convenient