PRODUCT
PCB
PCB Process Chemicals
OXIDE
E/L Cu
ACID Cu
S/E
Develop/Strip
ENIG
- Smart phones, Communications, Appliances, Electronics Rigid/Flexible PCB process Chemicals (e.g Plating)
- Mobile phones , Tablets , Chargers, NFC antenna, Cables
- Continuous development : Horizontal Electroless Copper , Conductive polymer ,ENEPIG
- Market expansion : Domestic PCB market and Securing overseas market (China, Vietnam)
PCB 약품 소개
D/F, PSR Process (Etching / Color developer)
|
Product |
Name |
Ratio(%) |
Work condition |
Characteristics |
|
YSP-202 Micro Etch additive |
YSP-202 |
2~4 |
YSP-202: 2~4%(v/v) at 25~35℃ (30) |
1. Micro-Etching solution for Cu surface treatment in PCB production 2. Chemical polish solution with High etching efficiency and excellent stability |
|
YSP-302 Micro Etch additive |
YSP-302 |
2~4 |
YSP-302: 2~4%(v/v) at 25~35℃ (30) |
1. Micro-Etching solution for Cu surface treatment in PCB production 2. Chemical polish solution with High etching efficiency and excellent stability |
|
YSP-202A (1-component Micro Etch) |
YSP-202A |
20~30 |
YSP-202A: 20~30%(v/v) at 25~30℃ (30) |
1. Micro-Etching solution of Copper surface treatment in PCB production. 2. High etch rate and better reliability. |
|
YSP-210 (KOH developer) |
YSP-210 |
2 |
YSP-210 : 20ml/L at 25~35℃ (30) |
1. Retaining High resolution 2. Convenience from Liquid type 3. Longer lifespan than Soda ash |
|
YSP-220 (NaCO3 developer) |
YSP-220 |
2 |
YSP-220 : 20ml/L at 25~35℃ (30) |
1. Retaining High resolution 2. Convenience from Liquid type 3. Longer lifespan than Soda ash |