PRODUCT
PCB
PCB Process Chemicals
OXIDE
E/L Cu
ACID Cu
S/E
Develop/Strip
ENIG
- Smart phones, Communications, Appliances, Electronics Rigid/Flexible PCB process Chemicals (e.g Plating)
- Mobile phones , Tablets , Chargers, NFC antenna, Cables
- Continuous development : Horizontal Electroless Copper , Conductive polymer ,ENEPIG
- Market expansion : Domestic PCB market and Securing overseas market (China, Vietnam)
PCB 약품 소개
Half Etching
| Product | Name | Ratio(%) | Temperature / Time | Work Type | Characteristics |
| YSP-H45 (Half etching) | YSP-H45 H2SO4 61% H2O2 35% | 1.0 ~ 2.0 4.0 ~ 5.0 7.0 ~ 9.0 | 25 ~ 40 ℃ (35℃) | - Spray type - Dip type | 1. Rapid etching (4 ~ 5㎛/min) 2. Stable thickness 3. Stable etching speed up to Cu 50~55g/L |
| YSP-H50 (Half etching) | YSP-H50 H2SO4 61% H2O2 35% | 1.0 ~ 20. 5.0 ~ 10.0 5.0 ~ 9.0 | 25 ~ 40 ℃ (35℃) | - Spray type - Dip type | 1. Rapid etching (5 ~ 9㎛/min) 2. Stable thickness 3. Stable etching speed up to Cu 0~30g/L |