PRODUCT
PCB
PCB Process Chemicals
OXIDE
E/L Cu
ACID Cu
S/E
Develop/Strip
ENIG
- Smart phones, Communications, Appliances, Electronics Rigid/Flexible PCB process Chemicals (e.g Plating)
- Mobile phones , Tablets , Chargers, NFC antenna, Cables
- Continuous development : Horizontal Electroless Copper , Conductive polymer ,ENEPIG
- Market expansion : Domestic PCB market and Securing overseas market (China, Vietnam)
PCB 약품 소개
PHT Process (Ion Type)
| Product | Name | Ratio(%) | Temperature/Time | Operation range | Characteristics |
| YSP-902 (Cleaner & Conditioner) | YSP-902 NaOH(98%) | 4.5 1 | 35 ~ 45℃ (40) 3 ~ 5 min | NaOH : 8 g/L YSP-902 : 45 ml/L | 1. Removal of tiny oxidation film 2. Excellent cleaning 3. Functions as conditioner |
| YSP-370 (Soft etch) | H2SO4(61%) YSP-370 H2O2(35%) | 1.0 5.0 6.7 | 30 ~ 40℃ (35) 1 ~ 3 min | H2SO4 : 150 ~ 180 g/L H2O2 : 70 ~ 90 g/L Copper : 50 g/L or below in Summer, 40g/L or below in Winter | 1. Enhancing adherence on electroless Cu plating 2. Stable gloss |
| YSP-470PD (Pre-dip) | H2SO4 (61%) YSP-470PD | 0.1 1.0 | 20 ~ 30℃ (25) 0.5 sec ~ 1 min | Supplement on usage 500M2B ⇒ YSP470Pd 1.5 L | 1. Removal of Oxide film occurred after S/E 2. Granting wettability for Pd adhesion |
| YSP-470 (Activator) | NaOH(98%) YSP-470 H3BO3 | 0.5 5.2 0.5 | 35 ~ 45℃ (40) 4 ~ 5 min | Pd : 150 ~ 200 mg/L pH : 10.0 ~ 11.5 Cu : 500 mg/L | 1. Pd adhesion on Cu foil |
| YSP-570 (Reducer) | H3BO3 YSP-570 | 0.5 0.5 | 20 ~ 30 ℃ (25) 3 ~ 5 min | YSP-570 Concentration : 4.0 ~ 6.0 ml/L | 1. Transition to metal palladium |
| YSP-880 (Thin Cu) | YSP-880 M YSP-880 A YSP-880 B | 12.0 6.5 3.0 | 24 ~ 30 ℃ 16 ~ 20 min | Plating thickness : 0.3 ~ 0.5 ㎛ (0.4) NaOH : 7.0 ~ 10.0 g/L (8.5) HCHO : 4.5 ~ 8.0 g/L (5.5) Cu : 1.6 ~ 2.2 g/L (1.9) | 1. Able to have even film (surface) 2. Strong covering power in though-hole 3. Able to deal dent pattern |
| YSP-890 (Heavy Cu) | YSP-890 M 25% NaOH YSP-890S 37% HCHO | 11.0 3.7 0.3 0.87 | 40 ~ 50℃ 25 ~ 30 min | Plating thickness : 2 ~ 3 ㎛ NaOH : 8.0 ~ 13.0 g/L (10.5) HCHO : 2.5 ~ 3.5 g/L (3.0) Cu : 2.5 ~ 3.1 g/L (2.8) | 1. High reliability 2, Strong covering power in though-hole 3. Able to deal dent pattern |