PRODUCT
PCB
PCB Process Chemicals
OXIDE
E/L Cu
ACID Cu
S/E
Develop/Strip
ENIG
- Smart phones, Communications, Appliances, Electronics Rigid/Flexible PCB process Chemicals (e.g Plating)
- Mobile phones , Tablets , Chargers, NFC antenna, Cables
- Continuous development : Horizontal Electroless Copper , Conductive polymer ,ENEPIG
- Market expansion : Domestic PCB market and Securing overseas market (China, Vietnam)
PCB 약품 소개
Desmear Process
| Product | Name | Ratio(%) | 온도 / 시간 | 관리 범위 | 특 징 |
| YSP140 (Sweller) | NaOH(25%) YSP-140 | 2.0 45.0 | 60 ~ 75℃ (65℃) 4 ~ 6 mins | YSP-140 : 400 ~ 500 ml/L Alkalinity(N) : 0.2 ~ 0.3 (0.25) | 1. Swelling Epoxy Resin surface 2. Softening Resin smear 3. Solvent as conditioner in hole |
| Epoxy etching | YSP-Permanganate S NaOH(98%) | 11 4.5 | 60 ~ 85℃ (70℃) 6 ~ 10 mins | MnO4 : 40 ~ 60 g/L (50) NaOH : 40 ~ 60 g/L (45) MnO42- : 18g/L or below | 1. Removed of Epoxy resin smear 2. Generates fine porosity resin |
| YSP-705 (Neutralizer) | YSP-705 H2SO4(61%) | 10 3.5 | 40 ~ 45℃ (42℃) 5 ~ 10 mins | YSP-705 : 75 ~ 125 ml/L (100) H2SO4 : 30 ~ 50 ml/L (40) Cu : 10 g/L or below | 1. Void prevention 2. Enhancing adherence on electroless Cu plating |