R&D
R&D History
R&D History
1999 ~ Now
2017 ~ 2021
2021
-
Resin / SCUM Cleaner (Akali / Acid)
Organic acid Soft etching (for Solder Mask / Plugged Pre-treatment)
2020
-
Photomask Liquid PR/DFR Release agent
2019
-
Burr Removal / High-gloss Soft Etching
2018
-
High phosphorus glossy Electroless Nickel
2017
-
PI(Poly Imide) process
2011 ~ 2016
2016
-
Chemical Nickel chloride bath
2015
-
Rack stripper
2013
-
PCB Soft-etching, Half-etching
2012
-
Technical Partnership with Ecosystem (Japan)
High density chemicals for PCB
2011
-
Dyed/ Non-dyed Cu sulfate brightener
Zinc Plating Brightener
2003 ~ 2010
2010
-
Copper sulfate electrolytic plating(PCB) Non-dyed brightener
Nickel plating brightener Process
2009
-
Electroless Nickel plating solution
Trivalent Chrome Chloride bath Electrolytic plating solution
2007
-
E.N.I.G Process
2005
-
Electroless PCB Cu plating chemicals (Pre-treatment / Post-treatment)
1999 ~ 2004
2004
-
R to R process Gold plating Solution
Cleaner solutions
2003
-
Chemical nickel for double injection
Electroless Nickel
2002
-
Electroless Gold plating
2001
-
Nickel brightener (high-gloss, half-gloss, Matte)
2000
-
Chrome additives
ABS Plating Process