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PRODUCT
GMF
PCB
PCB
PCB Process Chemicals
OXIDE
E/L Cu
ACID Cu
S/E
Develop/Strip
ENIG
Smart phones, Communications, Appliances, Electronics Rigid/Flexible PCB process Chemicals (e.g Plating)
Mobile phones , Tablets , Chargers, NFC antenna, Cables
Continuous development : Horizontal Electroless Copper , Conductive polymer ,ENEPIG
Market expansion : Domestic PCB market and Securing overseas market (China, Vietnam)
PCB 약품 소개
Degreasing Agent / Rust Inhibitor
Half Etching
Rack Release agent
Etching for High Density PCB / Burr Remove
Desmear Process
D/F, PSR Process (Etching / Color developer)
PHT Process (Ion Type)
D/F , PSR Process (DFR Release / Cleaning)
Brown Oxide Process
Rack Release agent
Product
Name
Ratio(%)
Conditions
Characteristics
Rack Releasing
YSP-250
YSP-250 : 1 ~ 3%
H2SO4(61%) : 10 ~ 14%
H2O2(35%) : 16 ~ 20%
Cu : 0~30 g/L
1. Removing Copper from Rack
2. Rapid releasing, least greasing, No Nitric acid contained