PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
EMI Plating Process
| Product | Use | Conditions | Characteristics |
| YS-CONDI | Conditioner | YS-CONDI : 100 ml/L at 60 ℃ | 1. High throwing power 2. Applicable to any kinds of resins |
| YUCATA-EMI-CATA | Catalyst | YUCATA-EMI-CATA : 8 ml/L Chloride acid (Reagent) : 270 ml/L at 35 ~ 39℃ | 1. Equally uniform catalyst particle, Excellent adhesion 2. Collide type, stable for long term |
| YS-EMI-Ni | Chemical Nickel plating | YS-EMI-Ni A : 50 ml/L YS-EMI-Ni B : 50 ml/L YS-EMI-Ni C : 100 ml/L | 1. High stability of the solution 2. Least impurity from reduction reaction which makes it possible to use longer 3. Equally uniform plating layer, excellent adhesion |
| YS-EMI-Cu | Chemical Copper plating | YS-EMI-Cu M (Initial) : 100 ml/L YS-EMI-Cu S : 3 ml/L YS-EMI-Cu A (supplement) | 1. High stability of the solution 2. Equally uniform catalyst particle, Excellent adhesion |