PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
Other Chemicals
| Product | Use | Conditions | Characteristics |
| YS-MINIST | Chromium plating Anti-gassing agent | Liquid : 1 ~ 2 ml/L Powder : 0.5 ~ 1 g/L | 1. Preventing mist 2. Reducing Drag-out by lowering surface tension 3. Preventing products of decomposition |
| SOLDERPOST-1 | Prevent tarnish | SOLDERPOST-1 : 100 ml/L at 20 ~ 40 ℃ for 5 ~ 30 sec | 1. Tarnish-resistant of Tin(Sn) layer in SMT process after plating |
| YUZINCAL-EZ-A | Zincate | YUZINCAL-EZ-A : 550 ml/L at 45 ~ 55 ℃ pH : 13 ~ 14 | 1. Generates Zinc immersion coating layer for multilayer deposits 2. Grants excellent adhesion to following layer 3. Broadly applicable to aluminum alloy |
| ANICOR-6 | Anti-tarnish sealing agent | ANICOR-6 : 100 ml/L at 60 ℃ Dipping: more than 30 sec | 1. Preventing stains or tarnish on plated surface 2. Zero influence on conductivity and solderability 3. Less-toxic which does not contain heavy metals |