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PRODUCT

GMF

GMF Chemicals

  • GOLD
  • NI-P
  • Sn
  • COPPER
  • Cr
  • E/T NI
  • Plating chemicals for Smart Phones
  • Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
  • Home appliances (E/T Ni ,Copper ,Cr)
  • Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)

GMF 약품 소개

Tin(Sn) Plating

ProductUseConditionsCharacteristics
YS-IT100Electroless Tin plating (Sn)Sn : 12 ~ 21 g/L at room temperature
for at least 1 min
Specific gravity (20℃) : 1.200 ~ 1.280
1. Even and clear Silver-white surface formation
2. Excellent solderability
3. High transference number
YST-55Stannous Sulfate GlossSulfuric acid (50%)  300 g/L
Stannous Sulfate   Rack : 30 g/L,  Barrel : 30 g/L
YST-55 Make-up A  40 ml/L
YST-55 Make-up B  10 ml/L
YST-55 Make-up C  18 ml/L		1. Stable and excellent gloss
2. Excellent organic contaminant resistance on surface
3. Covering wide range of electric current with stable plating thickness