PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
Electroless Nickel Plating
| Product | Use | Conditions | Characteristics |
| YSM-2000 | (Pd, Cd, Cr, Hg) Free Electroless Nickel plating Mid phosphorus ratio | 2000 M : 120 ml/L 2000 A : 60 ml/L 2000 B 2000 C | 1. Eco-friendly (No heavy metal contained) 2. Stable and excellent gloss 3. Able to use continuously 4. Best suitable for Aluminum plating |
| YSH-3000 | (Pd, Cd, Cr, Hg) Free High phosphorus ratio Electroless Nickel plating | 3000 M : 200 ml/L 3000 A : 50 ml/L 3000 B 3000 C | 1. Eco-friendly (No heavy metal contained) 2. Reliable 3. Excellent chemical resistance, solderability, chemical bonding |
| YS-200 (Glossy) | Mid phosphorus ratio Electroless Nickel plating | 200 M :100 ml/L 200 A : 50 ml/L 200 B 200 C | 1. Tarnish resistance 2. Excellent gloss, covering power, adhesion and corrosion resistance |
| YS-200 SB (Semi-Glossy) | (Pd, Cd, Cr, Hg) Free Mid phosphorus ratio, Semi glossy Electroless Nickel plating | 200SB M : 100 ml/L 200SB A : 50ml/L 200SB B 200SB C | 1. Eco-friendly (No heavy metal contained) 2. Reliable even after several turns |
| YS-300 | Mid-high phosphorus ratio Electroless Nickel plating | 300 M : 120 ml/L 300 A : 50 ml/L 300 B 300 C | 1. Cost efficient 2. High reliability of solution |
| YS-PE500 | High phosphorus ratio Electroless Nickel plating | YS-PE500 A : 60 ml/L YS-PE500 B : 180 ml/L YS-PE500 C pH Controller | 1. High corrosion resistance 2. High solderability, smoothness, scratch resistance, ductility of plating layer 3. Least sensitive to metallic impurity 4. Easy to use, and applicable to barreling |
| YS-1500 | Electroless Nickel plating | YS-1500 A : 60 ml/L YS-1500 B : 150 ml/L YS-1500 C pH Controller | 1. High decomposition rate (17~25μm per hour) 2. Up to 10 turns with steel materials, and more than 6 turns with Aluminum alloy 3. Cost efficient 4. High ductility and adhesion 5. Addible at working temperature |
| YS-2500 | (Pd, Cd, Cr, Hg) Free Extra low phosphorus ratio Electroless Nickel plating | 2500 M 2500 R 2500 A 2500 B | 1. Reliable of the solution 2. Up to 700Hv after decomposition 3. Very low phosphorus rate (1~4%) 4. Least affection to materials due to its neutrality, usable from Ceramics to metals 5. Low stress(-0.4kg/mm2), low electric resistance, high solderability which bring wide range of coverage |