PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
Copper Cyanide / Copper Sulfate Additives and Brighteners
| Product | Use | Conditions | Characteristics |
| YSC-2010CN | Copper cyanide plating additive | YSC-2010CN : 15 ~ 20 (15) ml/L at 30 ~ 60℃ Current density : 1 ~ 2 (1) A/dm2 | 1. Evenly glossy 2, High throwing power 3. Easy to manage depending on concentration change of free Cyanide |
| CP-1000 | Copper sulfate brightener | Mu : 4 ~ 8 ml/L A : 0.3 ~ 0.6 ml/L B : 0.2 ~ 0.4 ml/L | 1. Rapid plating rate 2. Excellent brightness through wide range of current density 3. Excellent leveling and wide range of plating bath temperature 4. Stable and anti-pit capability 5. fairly long lifespan and cost efficient 6. Broad coverage of impurity |