PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
Gold / Silver Plating
| Product | Use | Conditions | Characteristics |
| ULBRAQUA-HCL | Acidic Au-Co Gold plating | Basic solution : 700 ml/L | 1. Wide range of current density 2. Maintains leveling and gloss 3. Less resistance on contact 4. Suitable for use of rack and barrel |
| ULBRAQUA-HN | High speed acidic Au-Ni Gold plating | Basic solution : 700 ml/L | 1. Wide range of current density 2. Maintains leveling and gloss 3. Less resistance on contact 4. Long lifespan of the solution |
| ULBRAQUA-HNL | Acidic Au-Ni Gold plating for Rack and Barrel | Basic solution : 700 ml/L | 1. Wide range of current density 2. Maintains leveling and gloss 3. Less resistance on contact 4. Suitable for use of rack and barrel |
| ULBRAQUA-HC | High speed Au-Co Gold plating | Basic solution : 700 ml/L | 1. Wide range of current density 2. Maintains leveling and gloss 3. Less resistance on point of contact 4. Long lifespan of the solution |
| ULTRASIL | Silver plating brightener | ULTRASIL A : 20 ml/L ULTRASIL B : 10 ml/L | 1. Suitable for use of Rack, Barrel, and rapid plating 2. Excellent ductility 3. Enhanced soldering 4. High current applicable, and High speed of deposition |