PRODUCT
PCB
PCB Process Chemicals
OXIDE
E/L Cu
ACID Cu
S/E
Develop/Strip
ENIG
- Smart phones, Communications, Appliances, Electronics Rigid/Flexible PCB process Chemicals (e.g Plating)
- Mobile phones , Tablets , Chargers, NFC antenna, Cables
- Continuous development : Horizontal Electroless Copper , Conductive polymer ,ENEPIG
- Market expansion : Domestic PCB market and Securing overseas market (China, Vietnam)
PCB 약품 소개
EMI Plating Process
| Product | Use | Conditions | Characteristics |
| YS-CONDI | Conditioner | YS-CONDI : 100 ml/L at 60 ℃ | 1. High throwing power 2. Applicable to any kinds of resins |
| YUCATA-EMI-CATA | Catalyst | YUCATA-EMI-CATA : 8 ml/L Chloride acid (Reagent) : 270 ml/L at 35 ~ 39℃ | 1. Equally uniform catalyst particle, Excellent adhesion 2. Collide type, stable for long term |
| YS-EMI-Ni | Chemical Nickel plating | YS-EMI-Ni A : 50 ml/L YS-EMI-Ni B : 50 ml/L YS-EMI-Ni C : 100 ml/L | 1. High stability of the solution 2. Least impurity from reduction reaction which makes it possible to use longer 3. Equally uniform plating layer, excellent adhesion |
| YS-EMI-Cu | Chemical Copper plating | YS-EMI-Cu M (Initial) : 100 ml/L YS-EMI-Cu S : 3 ml/L YS-EMI-Cu A (supplement) | 1. High stability of the solution 2. Equally uniform catalyst particle, Excellent adhesion |