PRODUCT
PCB
PCB Process Chemicals
OXIDE
E/L Cu
ACID Cu
S/E
Develop/Strip
ENIG
- Smart phones, Communications, Appliances, Electronics Rigid/Flexible PCB process Chemicals (e.g Plating)
- Mobile phones , Tablets , Chargers, NFC antenna, Cables
- Continuous development : Horizontal Electroless Copper , Conductive polymer ,ENEPIG
- Market expansion : Domestic PCB market and Securing overseas market (China, Vietnam)
PCB 약품 소개
Gold / Silver Plating
| Product | Use | Conditions | Characteristics |
| ULBRAQUA-HCL | Acidic Au-Co Gold plating | Basic solution : 700 ml/L | 1. Wide range of current density 2. Maintains leveling and gloss 3. Less resistance on contact 4. Suitable for use of rack and barrel |
| ULBRAQUA-HN | High speed acidic Au-Ni Gold plating | Basic solution : 700 ml/L | 1. Wide range of current density 2. Maintains leveling and gloss 3. Less resistance on contact 4. Long lifespan of the solution |
| ULBRAQUA-HNL | Acidic Au-Ni Gold plating for Rack and Barrel | Basic solution : 700 ml/L | 1. Wide range of current density 2. Maintains leveling and gloss 3. Less resistance on contact 4. Suitable for use of rack and barrel |
| ULBRAQUA-HC | High speed Au-Co Gold plating | Basic solution : 700 ml/L | 1. Wide range of current density 2. Maintains leveling and gloss 3. Less resistance on point of contact 4. Long lifespan of the solution |
| ULTRASIL | Silver plating brightener | ULTRASIL A : 20 ml/L ULTRASIL B : 10 ml/L | 1. Suitable for use of Rack, Barrel, and rapid plating 2. Excellent ductility 3. Enhanced soldering 4. High current applicable, and High speed of deposition |