PRODUCT
PCB
PCB Process Chemicals
OXIDE
E/L Cu
ACID Cu
S/E
Develop/Strip
ENIG
- Smart phones, Communications, Appliances, Electronics Rigid/Flexible PCB process Chemicals (e.g Plating)
- Mobile phones , Tablets , Chargers, NFC antenna, Cables
- Continuous development : Horizontal Electroless Copper , Conductive polymer ,ENEPIG
- Market expansion : Domestic PCB market and Securing overseas market (China, Vietnam)
PCB 약품 소개
Tin(Sn) Plating
| Product | Use | Conditions | Characteristics |
| YS-IT100 | Electroless Tin plating (Sn) | Sn : 12 ~ 21 g/L at room temperature for at least 1 min Specific gravity (20℃) : 1.200 ~ 1.280 | 1. Even and clear Silver-white surface formation 2. Excellent solderability 3. High transference number |
| YST-55 | Stannous Sulfate Gloss | Sulfuric acid (50%) 300 g/L Stannous Sulfate Rack : 30 g/L, Barrel : 30 g/L YST-55 Make-up A 40 ml/L YST-55 Make-up B 10 ml/L YST-55 Make-up C 18 ml/L | 1. Stable and excellent gloss 2. Excellent organic contaminant resistance on surface 3. Covering wide range of electric current with stable plating thickness |