PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
Brown Oxide Process
|
Product |
Name |
Ratio(%) |
Temperature/time |
Operation range |
Characteristics |
|
YSP-BR100C (Cleaner) |
YSP-BR100C |
10 |
50∼60℃ 30∼60 sec |
YSP-BR100C 5∼15 vol% |
Alkalescent Cleaner |
|
YSP-BR100PD (Pre-Dip) |
YSP-BR100PD |
2 |
25∼30℃ 30∼60 sec |
YSP-BR100PD 2vol% |
None hydrogen peroxide |
|
YSP-BR100 (Oxide) |
YSP-BR100 |
100 |
32∼38℃ 45∼60 sec |
YSP-BR100 : 3.0 vol% H2SO4 : 4.5∼5.5 vol% H2O2(35%) : 3.5∼4.5 vol% |
Reliable adherence : 0.8-1.3kg/cm2 Stable coloration and applicable to high Tg products |