PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
D/F , PSR Process (DFR Release / Cleaning)
| Product | Name | Ratio(%) | Conditions | Characteristics |
| YSP-451 (Photo mask Release agent) | YSP-451 | 5 ~ 7 | YSP-451 : 50 ~ 70 ml/L at 40 ~ 60 ℃ Dipping : 25 ~ 40 sec | 1. Rapid and stable releasing by NaOH 2. Cost efficient 3, Discolor-less on Cu foil after apply 4. Rust-less (Cu, Sn, Pb) |
| YSP-400 (Release agent) | YSP-400 | 30 ~ 60 | YSP-400 : 300 ~ 600 ml/L at 40 ~ 60 ℃ Dipping : 12 ~ 20 min | 1. Rapid and stable releasing by Amine 2. Exclusive agent for dry film with over 100㎛ 3. Discolor-less on Cu foil after apply 4. Rust-less (Cu, Sn, Pb) |
| YSP-1215 (Defoamer) | YSP-1215 | YSP1215 : 6.6 ~ 26 ml/100L at 20 ~ 30 ℃ (25) Work duration : 30 sec ~ 1 min | 1. Excellent foam removing 2. Usable together with Liquid Alkaline strippers, Super Alkaline strippers 3. Applicable to Conveyer and Spray machines without damaging | |
| YSP-C3000 (Equipment Cleaner) | YSP-C3000 (Acid) | 15 ~ 30 | YSP-C3000 : 20 ml/L at 20 ~ 30 ℃ (25) Work duration : 1 ~ 2 hour | 1. Excellent cleaning all over inside of equipment 2. Rapid dissolve of dry film or sludge 3. High dissolution to dry film or sludge 4. Applicable at room temperature → Time saving and convenient 5. Least foaming in washing after cleaning 6. No need to breakdown and reassemble of equipment |
| YSP-C3500 (Resin Cleaner) | YSP-C3500 (Alkali) | 15 ~ 30 | YSP-C3500 : 20 ml/L at 30 ℃ Work duration : 1 ~ 2 hour | 1. Excellent resin scum cleaning 2. Rust-less on equipment due to low work temperature as compared to existing alkali type cleaner 3. Applicable at room temperature → Time saving and convenient |