PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
D/F, PSR Process (Etching / Color developer)
|
Product |
Name |
Ratio(%) |
Work condition |
Characteristics |
|
YSP-202 Micro Etch additive |
YSP-202 |
2~4 |
YSP-202: 2~4%(v/v) at 25~35℃ (30) |
1. Micro-Etching solution for Cu surface treatment in PCB production 2. Chemical polish solution with High etching efficiency and excellent stability |
|
YSP-302 Micro Etch additive |
YSP-302 |
2~4 |
YSP-302: 2~4%(v/v) at 25~35℃ (30) |
1. Micro-Etching solution for Cu surface treatment in PCB production 2. Chemical polish solution with High etching efficiency and excellent stability |
|
YSP-202A (1-component Micro Etch) |
YSP-202A |
20~30 |
YSP-202A: 20~30%(v/v) at 25~30℃ (30) |
1. Micro-Etching solution of Copper surface treatment in PCB production. 2. High etch rate and better reliability. |
|
YSP-210 (KOH developer) |
YSP-210 |
2 |
YSP-210 : 20ml/L at 25~35℃ (30) |
1. Retaining High resolution 2. Convenience from Liquid type 3. Longer lifespan than Soda ash |
|
YSP-220 (NaCO3 developer) |
YSP-220 |
2 |
YSP-220 : 20ml/L at 25~35℃ (30) |
1. Retaining High resolution 2. Convenience from Liquid type 3. Longer lifespan than Soda ash |