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PRODUCT

GMF

GMF Chemicals

  • GOLD
  • NI-P
  • Sn
  • COPPER
  • Cr
  • E/T NI
  • Plating chemicals for Smart Phones
  • Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
  • Home appliances (E/T Ni ,Copper ,Cr)
  • Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)

GMF 약품 소개

Desmear Process

ProductNameRatio(%)온도 / 시간관리 범위특 징
YSP140
(Sweller)
NaOH(25%)
YSP-140
2.0
45.0
60 ~ 75℃ (65℃)
4 ~ 6 mins		YSP-140 : 400 ~ 500 ml/L
Alkalinity(N) : 0.2 ~ 0.3 (0.25)
1. Swelling Epoxy Resin surface
2. Softening Resin smear
3. Solvent as conditioner in hole
Epoxy etching
YSP-Permanganate S
NaOH(98%)
11
4.5
60 ~ 85℃ (70℃)
6 ~ 10 mins		MnO4 : 40 ~ 60 g/L (50)
NaOH : 40 ~ 60 g/L (45) 
MnO42-  : 18g/L or below
1. Removed of Epoxy resin smear
2. Generates fine porosity resin
YSP-705
(Neutralizer)
YSP-705
H2SO4(61%)
10
3.5
40 ~ 45℃ (42℃)
5 ~ 10 mins		YSP-705 : 75 ~ 125 ml/L (100)
H2SO4 : 30 ~ 50 ml/L (40)
Cu : 10 g/L or below
1. Void prevention
2. Enhancing adherence on electroless Cu plating