PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
Etching for High Density PCB / Burr Remove
| Product | Name | Ratio(%) | Conditions | Characteristics |
| YSP-M13 Micro roughness | YSP-M13 H2SO4(61%) H2O2 (35%) | 3.0 6.5 5.5 | YSP-M13 : 30 ml/L 25 ~ 35℃ (30℃) | 1. Build brightness for steady adhesion of dry film 2. High adhesion improved 3. Matte type |
| YSP-402 Micro roughness | YSP-402 H2SO4(61%) H2O2 (35%) | 3 7.5 6.0 | YSP-402 : 30 ml/L 25 ~ 35℃ (30℃) | 1. Excellent with generating steady brightness 2. High adhesion 3. Semi-bright type |
| YSP-DB2 Burr remove | YSP-DB H2SO4(61%) H2O2 (35%) | 3 5 4 | YSP-DB : 30 ml/L 25 ~ 35℃ (30℃) | 1. Steady brightness 2. Commonly used as pre-treatment 3. Great in removing surface stains and resin |
| YSP-502 Burr remove Micro roughness | YSP-502 H2SO4(61%) H2O2 (35%) | 1 5 2 | YSP-502 : 10 ml/L 25 ~ 35℃ (30℃) | 1. Steady brightness 2. Commonly used as pre-treatment 3. Great in removing surface stains and resin |