PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
Rack Release agent
| Product | Name | Ratio(%) | Conditions | Characteristics |
| Rack Releasing | YSP-250 | YSP-250 : 1 ~ 3% H2SO4(61%) : 10 ~ 14% H2O2(35%) : 16 ~ 20% | Cu : 0~30 g/L | 1. Removing Copper from Rack 2. Rapid releasing, least greasing, No Nitric acid contained |