PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
Half Etching
| Product | Name | Ratio(%) | Temperature / Time | Work Type | Characteristics |
| YSP-H45 (Half etching) | YSP-H45 H2SO4 61% H2O2 35% | 1.0 ~ 2.0 4.0 ~ 5.0 7.0 ~ 9.0 | 25 ~ 40 ℃ (35℃) | - Spray type - Dip type | 1. Rapid etching (4 ~ 5㎛/min) 2. Stable thickness 3. Stable etching speed up to Cu 50~55g/L |
| YSP-H50 (Half etching) | YSP-H50 H2SO4 61% H2O2 35% | 1.0 ~ 20. 5.0 ~ 10.0 5.0 ~ 9.0 | 25 ~ 40 ℃ (35℃) | - Spray type - Dip type | 1. Rapid etching (5 ~ 9㎛/min) 2. Stable thickness 3. Stable etching speed up to Cu 0~30g/L |