PRODUCT
GMF
GMF Chemicals
GOLD
NI-P
Sn
COPPER
Cr
E/T NI
- Plating chemicals for Smart Phones
- Surface treatment for IT and Communication related components (GOLD, NI-P, SN, Copper, Cr+3, E/T Ni)
- Home appliances (E/T Ni ,Copper ,Cr)
- Plating Chemicals for Accessories (Au, Ag, Cu , Cr+3)
GMF 약품 소개
Degreasing Agent / Rust Inhibitor
| Product | Name | Ratio (%) | Temperature / Time | Characteristics |
| YSP-125 (Acid Cleaner) | YSP-125 Water | 10 Balance | 25 ~ 45℃ (35℃) 3 ~ 6 min | 1. Excellent degreasing on Copper foil 2. Removal of dry film residue 3. Convenient to use 4. Horizontal acid cleaning |
| YSP-135 (Acid Cleaner) | YSP-135 Water | 10 Balance | 40 ~ 60℃ (50℃) Immersion : 2 ~ 3 min Spray : 0.5 ~ 1min | 1. Suitable for degreasing and vitality in PCB 2. Commonly used for pattern plating 3. Vertical acid cleaning |
| YSP-145 (Akali Cleaner) | YSP-145 Water | 10 Balance | 45 ~ 65℃ (55℃) Spray : 0.5 ~ 3 min | 1. Excellent degreasing on Copper foil 2. Convenient to use 3. Vertical acid cleaning |
| YSP-660 (Rust inhibitor) | YSP-660 Water | 1.0 99.0 | 30 ~ 60℃ (45℃) 0.5 ~ 3min pH : 6 | 1. Excellent efficiency 2. Not affecting the following process 3. Easy disposal of chemical waste |